3W UV Laser Marking Machine
3W UV Laser Marking Machine
All in one body, chiller installed inside, easy to move and operate, pack size is more smaller.
Model |
DGUV-3 |
Wavelength |
355nm |
Output Power |
>5W@30kHz |
Repetition Rate |
10kHz~200kHz |
Pulse Width |
<15ns@30kHz |
Power Stability |
≤5%rms |
Pulse Stability |
≤3%rms |
Spatial Mode |
TEM00(M2≤1.2) |
Beam Diameter |
≤4(mm) |
Beam Divergence |
≤2mrad |
Beam Pointing Stability |
<25μrad |
Beam Circularity |
≥90% |
Polarization Extinction Ratio |
Horizontal,100:1 |
Gain Medium |
Nd:YVO4 |
Warm-up Time |
<10min |
Operating Temperature |
10-35℃ |
Operating Humidity |
<65% |
Cooling |
Water |
Power Supply |
110/220V AC,20/60Hz |
Classification |
Class 4 |
Laser Head Dimensions |
320X152.4x107.2(mm) |
Laser Head
Laser Power
Water Pipe
Application
1.Solar wafer greeve cutting
2. Thin film etching
3. cutting, scribing, marking
4. Glass, wafer cutting
5. Precision machining of materials
6. Flexible circuit board processing
Working environment
1. Industrial harsh environment
2. Long-term work stability, can meet 24/7 industrial application
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